Exploring High-Density Power Solutions with TDK

Join Bryan DeLuca as he explores cutting-edge power solutions with Parviz Parto at the TDK booth during APEC 2025. Discover TDK's latest technology, the highest power density available for AI servers, 5G, and optical networking applications. Learn how their compact solutions significantly reduce board size while enhancing performance and flexibility. Parviz showcases products ranging from 3 amps up to 200 amps, highlighting TDK’s unique ability to offer compact, high-density power solutions that simplify design challenges, lower system costs, and improve overall efficiency. Stay ahead of the curve by seeing how these advanced components address the most demanding requirements in AI, telecom, and next-generation networking applications.