Microchip Showcases Advanced Power Packaging and High-Voltage Solutions

At APEC 2026, Bryan DeLuca stopped by the Microchip booth to speak with Nitesh about the company’s latest innovations in power semiconductor packaging.

While Microchip is widely known for microcontrollers, the company is also expanding its presence in power electronics, offering solutions in both silicon and wide bandgap technologies such as silicon carbide. These solutions target applications ranging from AI data centers and energy storage to solar and industrial systems.

Microchip highlighted a range of packaging options, including surface-mount and topside-cooled designs like PSMT and QDPAK, as well as RF silicon FETs used in semiconductor manufacturing equipment.

The company also showcased its power modules, including new BZ packages designed for industrial applications. These devices meet emerging reliability standards, achieving up to 3000 hours in high-temperature reverse bias (HTRB) testing—well beyond the typical 1000-hour requirement.

For higher voltage applications, Microchip introduced an updated 62 mm package capable of supporting up to 3.3 kV. This enables use in next-generation systems such as solid-state transformers, which are being explored as more efficient alternatives to traditional transformers in data center power delivery.

With a focus on improved reliability, higher voltage capability, and optimized packaging, Microchip is positioning its power portfolio to meet the evolving demands of modern power electronics.

Learn more at: https://www.microchip.com/