How Vertical Power Delivery Is Changing AI Chip Design
How Vertical Power Delivery Is Changing AI Chip Design 
As AI processors demand more power, traditional power delivery architectures are running into limitations involving efficiency, board space and performance.
In this eeVids interview, Mukund Krishna, Director of Product Marketing at Empower Semiconductor, now part of Analog Devices, discusses the growing challenges of delivering power to high-performance AI processors and why the industry is shifting from lateral to vertical power delivery.
Krishna explains how placing power conversion directly beneath the processor helps reduce distribution losses, improve voltage regulation and free up valuable PCB space. He also discusses Empower's Crescendo technology and its approach to power density, efficiency and thermal management.
Learn how advances in power delivery are helping address one of the challenges facing next-generation AI hardware.